ARC Orlando Forum February 10-13, 2014

2013-12-20

OMAC will hold several meetings in Orlando, FL on 13-14 February at the Renaissance Orlando at Sea World hotel.  The OMAC meetings occur at the end of the ARC Industry Forum

OMAC Board Members highlight success of PackML

2013-11-12

Board members Mark Ruberg and Dan Amundson discuss OMAC with Summit’s Pat Reynolds during PACK EXPO Las Vegas 2013.

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With PackML in Action, PACK EXPO Las Vegas Connections Were Clear

2013-11-12

The Organization for Machine Automation and Control (OMAC), best known for the PackML standard, generated more interest than ever with a demonstration of PackML in action at PACK EXPO Las Vegas (Sept. 23–25, 2013; Las Vegas Convention Center).

OMAC, an organization for automation and manufacturing professionals, supports the machine automation and operation needs of manufacturing. The group used its presence at PACK EXPO to demonstrate the interoperability between control platforms using standards it has adopted and/or developed.

Pro Mach’s Mark Ruberg Discusses PackML and Business Benefits to OEMs and Users

2013-11-12

OMAC Workshops Draw Crowds to Cincinnati

2013-05-28

OMAC Welcomes Corporate Member MillerCoors

2013-04-23

OMAC Packaging Workgroup Industry Survey

2012-08-05
After completing the survey, you can contact the Chairman of the OMAC Packaging Workgroup, Bryan Griffen from Nestle (Bryan.Griffen@rdor.nestle.com) for more information on how to join the OMAC Packaging Workgroup.
 

Nestle articulates PackML's benefits

2012-07-19

The Automation Conference held in Chicago, IL May 22-23, provided a golden opportunity for Nestle’s Bryan Griffen to deliver an update on recent initiatives of the OMAC Packaging Workgroup. Griffen, who is the OPW chairman, was one of the keynote speakers at the conference, which is produced by Automation World and Packaging World.

Nestle Tackles Packaging Automation that Defies Standardization

2012-07-03
Nestlé global automation manager Dr. Bryan Griffen says his company’s multi-vendor OMAC packaging simulation line is tackling topics "that have defied standardization" and that will "contribute to simplified and more efficient packaging operations." Topics include HMI screen designs, international standards, and on-machine diagnostics.
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