OMAC to Provide Training Session at Packaging Automation Forum 2008

Research Triangle Park, NC (21 February 2008) - OMAC has announced their participation in the Packaging Automation Forum 2008, May 19-20, 2008, at the Chicago Marriott Schaumburg.
OMAC will provide a half day training session for attendees on Monday, May 19, at 1:00 p.m. The session will be broken up into a Make2Pack Workshop and a Hands-on Connect-and-Pack(tm) Demonstration.
Dave Chappell, Chairman Make2Pack and Former Corporate Technical Section Head at Procter & Gamble, will serve as the Workshop Facilitator for the Make2Pack Workshop, scheduled to take place from 1:00 p.m. - 3:00 p.m.
Workshop attendees will learn the "intent" of the Make2Pack standards that will be used by industry to develop and support factory floor automation. As these new standards gain acceptance, they will impact and improve manufacturing operations. This educational session will better prepare attendees to benefit from these evolving changes.
As the Workshop Facilitator, Chappell will share his comprehensive knowledge of Make2Pack standards in an optimum learning environment.
Workshop goals include providing attendees a better understanding of the intent and purpose of the standards, helping attendees better understand how the standards can affect and benefit their operations, and sharing insight on and details about implementation of the standards.
The Hands-on Connect-and-Pack(tm) Demonstration will take place from 3:00 p.m. - 5:00 p.m. following a brief overview of the
Connect-and-Pack(tm) Demonstration.
OPW (the OMAC Packaging Workgroup) will provide this "hands-on" session intended to educate and inform the packaging community about the ease of integrating various packaging line functions (control, HMI, MES) using the OPW Connect-and-Pack(tm) guidelines.
The Connect-and-Pack(tm) guidelines make packaging operations more effective by simplifying customization and integration, enabling world class packaging operations. When properly implemented, these guidelines aid packaging companies and their partners in optimizing operations as they gain a competitive advantage by leveraging an integrated supply chain.
During the hands-on session, attendees will be afforded the opportunity to see how the participating technology providers will be implementing one or more of the packaging line functions (control, HMI, MES)
utilizing the Connect-and-Pack(tm) guidelines. 
Each technology provider will show:
•    How PackML and PackTags are implemented on their system
•    How OPC is configured to enable PackTags to be communicated to other demo applications (control, HMI, MES)
•    What documentation is provided for aiding in implementation of the Connect-and-Pack(tm) guidelines
•    What templates are provided for simplifying the configuration of a Connect-and-Pack(tm) application
To learn more , visit www.omac.org or call (919) 314-3900.
To learn more about the Packaging Automation Forum 2008, visit www.packworld.com/paf.