OMAC Will Be at Packaging Automation Forum 2008!
Event Information:
Packaging Automation Forum 2008
Tuesday, May 20, 2008
Chicago Marriott Schaumburg
Training Sessions will be held Monday, May 19, 2008.
www.packworld.com/paf/
OMAC Hands-On Demo Presentations
Make2Pack Workshop Presentation
OMAC Activities:
Make2Pack Workshop
Monday, May 19, 2008
1:00 p.m.–3:00 p.m.
Presented by Dave Chappell, Chairman Make2Pack and Former Corporate Technical Section Head at Proctor & Gamble.
Workshop attendees will learn the "intent" of the Make2Pack standards that will be used by industry to develop and support factory floor automation. As these new standards gain acceptance, they will impact and improve your manufacturing operations. This educational session will better prepare you to benefit from these evolving changes.
Learn from those who helped to create these new concepts and approaches. As the Workshop Facilitator, Dave Chappell will share his comprehensive knowledge of Make2Pack standards in an optimum learning environment. Class size will be limited to encourage personalized attention.
Workshop Goals:
- Provide attendees a better understanding of the intent and purpose of the standards
- Help attendees better understand how the standards can affect and benefit their operations
- Share insight on and details about implementation of the standards
Hands-on Connect-and-Pack™ Demonstrations
Monday, May 19, 2008
3:00 p.m.–5:00 p.m.
Hands-on Demonstration Providers:
Following a brief overview of the Connect-and-Pack™ Demonstration, OPW (the OMAC Packaging Workgroup) will provide a hands-on session intended to educate and inform the packaging community about the ease of integrating various packaging line functions (control HMI, MES) using the OPW Connect-and-Pack™ guidelines.
The Connect-and-Pack™ guidelines make packaging operations more effective by simplifying customization and integration, enabling world class packaging operations. When properly implemented, these guidelines aid packaging companies and their partners in optimizing operations as they gain a competitive advantage by leveraging an integrated supply chain.
During the hands-on session, attendees will be afforded the opportunity to see how the participating technology providers will be implementing one or more of the packaging line functions (control, HMI, MES) utilizing Connect-and-Pack™ guidelines.
Each technology provider will show:
- How PackML and Packtags are implemented on their system
- How OPC is configured to enable PackTags to be communicated to other demo applications (control, HMI, MES)
- What documentation is provided for aiding in implementation of the Connect-and-Pack™ guidelines
- What templates are provided for simplifying the configuration of a Connect-and-Pack™ application
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General Information
